100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets

1. This 100PCS copper shim set is specifically designed for repairing Android smartphone CPUs, providing targeted heat dissipation after chip reballing or motherboard maintenance.
2. Precision-customized 12.4x14mm short-circuit prevention dimensions ensure full coverage of the chip surface without edge overhang, avoiding contact and short circuits with surrounding components.
3. Made of oxygen-free pure copper, significantly reducing chip temperature when used with thermal paste.
4. Three thickness options (0.1/0.3/0.5mm) available to fit different device models.
5. Replaces damaged OEM thermal materials after CPU rework, reducing the risk of device failure caused by inadequate factory-restored cooling.