1. Direct heating design helps improve heating efficiency during solder ball placement, making it suitable for GPU chip repair and BGA reballing. 2. Features a 0.25mm stencil specification for precision BGA reballing on compatible solder pad layouts. 3. Designed for BGA reballing applications involving compatible GPU chips, including RTX 2080, RTX 2070, RTX 2060, and GTX 1660. 4. Provides stable positioning and support during GPU reballing, helping technicians place solder balls and restore solder connections. 5. Suitable for electronics repair workshops, graphics card servicing, and professional BGA chip rework applications.
