1 8

LUOWEI HS3-Pro Motherboard Stacked BGA Soldering Rework Station

LUOWEI HS3-Pro Motherboard Stacked BGA Soldering Rework Station

$58.01 USD
$58.01 USD
Alennusmyynti Loppuunmyyty

EDA0100613
1. Employs high-efficiency heating elements and thermally conductive materials, ensuring rapid heating in just 1 minute.
2. Precise hole alignment and positioning, zero-error calibration, no shaking, ensuring precise control with every operation.
3. High-precision positioning and manufacturing, with near-zero error, improving maintenance efficiency.
4. Adjustable temperature from 0-260 degrees Celsius, high-precision PID temperature control algorithm.
5. Compatible with X-17 series Apple layered modules, making module replacement more convenient.


Specification:
General
Compatible with
Apple: iPhone 17e, iPhone 17 Pro, iPhone 17 Pro Max, iPhone 17, iPhone 16e, iPhone 16, iPhone 16 Plus, iPhone 16 Pro Max, iPhone 16 Pro, iPhone 15, iPhone 15 Pro Max, iPhone 15 Pro, iPhone 15 Plus, iPhone 14 Plus
Package Weight
One Package Weight 0.40kgs / 0.89lb
One Package Size 13cm * 12cm * 12cm / 5.12inch * 4.72inch * 4.72inch
Qty per Carton 24
Carton Weight 10.60kgs / 23.37lb
Carton Size 54cm * 38cm * 26cm / 21.26inch * 14.96inch * 10.24inch
Loading Container 20GP: 499 cartons * 24 pcs = 11976 pcs
40HQ: 1160 cartons * 24 pcs = 27840 pcs

Näytä kaikki tiedot
Tuote Tuotteen välisumma Määrä Hinta Tuotteen välisumma
LUOWEI HS3-Pro Motherboard Stacked BGA Soldering Rework Station
LUOWEI HS3-Pro Motherboard Stacked BGA Soldering Rework Station
<span class=trans-money>$58.01 USD</span>/kpl		 $0.00 USD
<span class=trans-money>$58.01 USD</span>/kpl $0.00 USD
Document
Fast Shipping Optional Shipping Methods 
Free Returns 14 Day Free Returns
Wholesale Price Local Service Meet Your Every Need
2 Year Warranty Quality Assurance