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Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-purpose Steel Mesh

Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-purpose Steel Mesh

通常価格 $3.25 USD
通常価格 セール価格 $3.25 USD
セール 売り切れ

SKU:TBD0606276401


1. These templates can be heated for re-filling BGA unit chips, which is very simple and quick
2. It solves the problems encountered by computer maintenance engineers when using directly heated steel nets. It is durable and long-lasting
3. The success rate of tin planting is high. After proficient operation, solder balls can be formed in one go, and it is simple and convenient to use
4. High quality materials, resistant to high temperatures and wear and tear
5. Material: stainless steel


Specification:
Package Weight
One Package Weight 0.11kgs / 0.25lb
One Package Size 22cm * 12cm * 4cm / 8.66inch * 4.72inch * 1.57inch
Qty per Carton 48
Carton Weight 7.00kgs / 15.43lb
Carton Size 48cm * 38cm * 34cm / 18.9inch * 14.96inch * 13.39inch
Loading Container 20GP: 429 cartons * 48 pcs = 20592 pcs
40HQ: 998 cartons * 48 pcs = 47904 pcs

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