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JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform For iPhone 17 Series

JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform For iPhone 17 Series

정가 $8.66 USD
정가 할인가 $8.66 USD
할인 품절

SKU(재고 관리 코드):EDA0101269

1. Dedicated soldering fixture for mid-layer motherboard repair, suitable for mid-layer resoldering repair of Apple 17 series motherboards.
2. Zero positioning error and no wobbling; precise alignment of the motherboard and stencil for stable soldering results.
3. Built-in strong magnet automatically attracts and fixes the soldering stencil, eliminating the need for manual alignment; the stencil remains stable and does not shift during the soldering process.
4. Anti-static and corrosion-resistant; withstands high-temperature operation with hot air guns; prevents solder explosion and improves repair and soldering efficiency.
5. Square-hole stencil is less prone to clogging; ensures even and full soldering, guaranteeing the quality of mid-layer solder joints on the motherboard.
6. Shared base; only the positioning mold and stencil need to be replaced to adapt to different models.
Specification:
General
Compatible with
Apple: iPhone 17 Pro, iPhone 17 Pro Max, iPhone 17
Package Weight
One Package Weight 0.07kgs / 0.16lb
One Package Size 15cm * 8cm * 2cm / 5.91inch * 3.15inch * 0.79inch
Qty per Carton 270
Carton Weight 19.90kgs / 43.87lb
Carton Size 50cm * 47cm * 32cm / 19.69inch * 18.5inch * 12.6inch
Loading Container 20GP: 354 cartons * 270 pcs = 95580 pcs
40HQ: 823 cartons * 270 pcs = 222210 pcs

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JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform For iPhone 17 Series
JTX M29 Middle Layer BGA Reballing Stencil Tin Planting Platform For iPhone 17 Series
개당 <span class=trans-money>$8.66 USD</span>
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개당 <span class=trans-money>$8.66 USD</span> $0.00 USD

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