1. Multiple sizes available: 4Pcs A blades, 4Pcs B blades, 4Pcs C blades, 4Pcs D blades, 1 each of ABCD
2. Cutting edge glue/IC Pad Glue Cleaning/ Motherboard IC / CPU Remove (B-hard/C-soft)
3. High carbon elastic steel, high hardness, corrosion resistance, high temperature resistance, durable and wear-resistant
4. Professional side glue removal tools: The tip is thin and hard enough. Easy to cut rubber, not easy to deform
5. Easy insertion and smooth removal: Android CPU/EMMC and other chip warp knife (hard)
6. Cutting vinyl, no damage to the board: Silky smooth spatula glue in a single stroke, smooth and rounded, no damage to the bottom of the board
7. Good blade tough: Soft warp knives better suited for Apple CPUs and other chips
8. Strong toughness, no deformation: Rigid and flexible, not damage board, toughness, rebound without deformation
Specification:
| Package Weight |
| One Package Weight |
0.02kgs / 0.05lb |
| One Package Size |
2cm * 8cm * 10cm / 0.79inch * 3.15inch * 3.94inch |
| Carton Weight |
6.00kgs / 13.23lb |
| Carton Size |
52cm * 42cm * 22cm / 20.47inch * 16.54inch * 8.66inch |
| Loading Container |
20GP: 555 cartons * 250 pcs = 138750 pcs
40HQ: 1288 cartons * 250 pcs = 322000 pcs
|
|
