1. Dual-Sided Design: The reballing base is designed with two usable sides, allowing technicians to work with different NAND or BGA chip types without switching platforms. This greatly improves workflow efficiency. 2. Strong Magnetic Fixation: The built-in strong magnets securely hold the chip in place, preventing movement during solder paste application or hot-air heating. This magnetic stability reduces issues such as solder bridging or misalignment. 3. Designed Specifically for NAND Flash: The BH16 model is optimized for NAND flash chips, especially BGA-type NAND used in smartphones and tablets. 4. It typically includes matching stencils such as BGA110 and BGA315, making it highly compatible with common NAND packages, including iPhone series NAND. 5. Built to withstand the high temperatures from hot-air guns and heating stations, the platform maintains structural integrity and durability, making it suitable for frequent, professional-level use. 6. Package includes: 1 x Magnetic Base 2 x Stencil
