100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets

$4.27 USD

Em promoção Esgotado

SKU:TBD0606460301

Option 0.1mm 0.3mm 0.5mm

Quantidade

1. This 100PCS copper shim set is specifically designed for repairing Android smartphone CPUs, providing targeted heat dissipation after chip reballing or motherboard maintenance.
2. Precision-customized 12.4x14mm short-circuit prevention dimensions ensure full coverage of the chip surface without edge overhang, avoiding contact and short circuits with surrounding components.
3. Made of oxygen-free pure copper, significantly reducing chip temperature when used with thermal paste.
4. Three thickness options (0.1/0.3/0.5mm) available to fit different device models.
5. Replaces damaged OEM thermal materials after CPU rework, reducing the risk of device failure caused by inadequate factory-restored cooling.

Specification:

Package Weight

One Package Weight

0.03kgs / 0.07lb

One Package Size

10cm * 10cm * 8cm / 3.94inch * 3.94inch * 3.15inch

Qty per Carton

Carton Weight

2.70kgs / 5.95lb

Carton Size

32cm * 50cm * 32cm / 12.6inch * 19.69inch * 12.6inch

Loading Container

20GP: 520 cartons * 54 pcs = 28080 pcs
40HQ: 1209 cartons * 54 pcs = 65286 pcs

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O seu carrinho
Variante	Variante total	Quantidade	Preço	Variante total
0.1mm	0.1mm <span class=trans-money>$4.27 USD</span>/cada	$0.00 USD	Quantidade	<span class=trans-money>$4.27 USD</span>/cada	$0.00 USD

0.3mm	0.3mm <span class=trans-money>$4.54 USD</span>/cada	$0.00 USD	Quantidade	<span class=trans-money>$4.54 USD</span>/cada	$0.00 USD

0.5mm	0.5mm <span class=trans-money>$5.42 USD</span>/cada	$0.00 USD	Quantidade	<span class=trans-money>$5.42 USD</span>/cada	$0.00 USD