1. 3 in 1 Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 17 / 17 Pro / 17Pro Max
2. To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
3. Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
4. CNC high-precision integrated processing, stable positioning for the motherboard, and no deviation in reballing
5. Strong magnetic attraction, accurate positioning, no offset, and encountering high-temperature magnetism will not weaken
6. High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature
7. Avoiding the SIM card base not being tinned while the motherboard is tinned
8. An imported selection of high-quality steel material, manufactured under QianLi black stencils standard, with wear resistance, ultra-high toughness to support reballing
9. Square chamfer mesh prevents the tin balls from being stuck in the mesh
10. Package includes:
1 x Reballing Platform
3 x Stencil
Specification:
| General |
| Compatible with |
Apple: iPhone 17 Pro, iPhone 17 Pro Max, iPhone 17
|
|
| Package Weight |
| One Package Weight |
0.18kgs / 0.41lb |
| One Package Size |
11cm * 8cm * 17cm / 4.33inch * 3.15inch * 6.69inch |
| Carton Weight |
6.40kgs / 14.11lb |
| Carton Size |
42cm * 35cm * 36cm / 16.54inch * 13.78inch * 14.17inch |
| Loading Container |
20GP: 503 cartons * 30 pcs = 15090 pcs
40HQ: 1169 cartons * 30 pcs = 35070 pcs
|
|
