1. Precision 0.12mm Design: Features 0.12mm pinholes, perfectly suited for iPhone 17 Series CPU BGA reballing. 2. High-Accuracy Reballing Tool: Nickel-plated steel stencil ensures precise solder ball placement, improving soldering success rates. 3. Durable Material: Made from high-quality wear-resistant steel, heat-resistant and deformation-free, suitable for repeated use. 4. Professional Repair Tool: Designed for technicians and professional repair shops, improving CPU BGA chip replacement and repair efficiency. 5. Wide Compatibility: Compatible with iPhone 17 Series CPU/BGA reballing applications. 6. Enhances Soldering Efficiency: Accurate hole placement minimizes solder ball displacement, reduces rework, and increases workflow efficiency.
