1. Engineered specifically for mid-layer BGA reballing on smartphone motherboards, ensuring accurate alignment and consistent solder joints. 2. Integrated magnetic structure securely holds chips and stencil in place, preventing displacement during heating and reflow. 3. Comes with matched stencil support for fast alignment and uniform solder ball planting, significantly improving workflow efficiency. 4. Manufactured with premium-grade materials and precision machining, offering excellent durability, heat resistance, and long service life. 5. Compact and lightweight design (about 44g) allows for precise operation and easy handling in high-frequency repair tasks. 6. Package includes: 1 x Positioning Plate 4 x Stencil
